polishing wafer
polishing wafer
shared：
polished wafer Specifications
| Thickness（μm） | TTV（μm） | TIR（μm） | BOW（μm） | WARP（μm） | LLS(ea） | ||
| FZ-Si-polished wafer | Single side polished wafer | 150-1500 | ≤5 | ≤5 | ≤20 | ≤20 | <10@0.3μm |
| Double sides polished wafer | 150-1500 | ≤5 | ≤5 | ≤20 | ≤20 | <10@0.3μm | |
| CZ-Si-polished wafer | Single side polished wafer | 150-1500 | ≤5 | ≤5 | ≤20 | ≤20 | <10@0.3μm |
| Double sides polished wafer | 150-1500 | ≤5 | ≤5 | ≤20 | ≤20 | <10@0.3μm | |
Note：If customer has any special requirements on geometrical parameters, we can process accordingly.
Previous：
CZ-Si
